Why choose ThermoRack 1801?

  • 1,800 watts of cooling capacity – 50% more capacity than ThermoRack 1201 in the same 5U rackmount enclosure
  • ±0.05°C Temperature Stability/repeatability
  • Operating range from -20°C to 80°C
  • Designed for very fast response
  • Available in standard high flow, medium flow and low flow configurations
  • Reduces wafer to wafer variations and eliminates first wafer effect
  • Up to 80% more energy efficient than compressor-based chillers
  • Uses thermoelectric technology for high reliability and reduced maintenance cost
  • Simple design – only 2 moving parts
  • Eliminates Freon and other harmful refrigerants to comply with new environmental regulations
  • Uses less facility water and expensive coolants, such as Fluorinert or Galden
  • Compact size: Up to 6 TR1801 systems fit in the space of 1 compressor chiller
  • Communication interfaces available for AMAT, LAM, TEL and Hitachi systems
  • Universal power – plug in and go anywhere in the world
  • An excellent solution for plasma etch, plasma ash, CMP and other processes


ThermoRack 1801 Cooling Curves High Flow

ThermoRack 1801 Cooling Curves Low-Med Flow

ThermoRack 1801 Pump Curves Low - Med Flow

ThermoRack 1801 Pump Curves


Operating Range:
-20°C to 80°C (N2/CDA required)
LT Option required if operating below 0°C
Ambient Temperature:
10°C to 40°C non-condensing
Stability / Repeatability:
± 0.05°C at constant load (even near ambient)
Cooling Capacity*:
1,600-2,000 watts @ 20°C with 20°C facility water
depending on cold plate and process fluid
Heating Capacity**:
3,000-3,400 watts @ 20°C with 20°C facility water
depending on cold plate and process fluid
Coolant / Process Fluid:
Fluorinert / Galden / HFE or Water/Glycol
Process Fluid Fittings:
1/2" Swagelok 1/2" Swagelok (316 stainless steel)
Brushless DC magnetically driven centrifugal
Flow Rate:
(see pump curves)
Tank Volume:
5.7 liter (1.5 gal) with 2 level sensors
Facility Water:
8-12 lpm (2-3 gpm) @ 10-35°C filtered, treated recirculating facility cooling water, pH 6.5 to 8.2
Facility Water Fittings:
1/2" Swagelok (316 stainless steel)
N2/CDA (Required):
500 sccm -30°C dew point or lower CDA or N2,
30-60 psig (2-4 bar) for low temperature operation
Wetted Materials:
Process: Aluminum, stainless steel and polymers
Facility: Sealed hard anodized aluminum
and stainless steel
Size (W x D x H):
19" x 24" x 8.7" 5U (48 cm x 61 cm x 22 cm)
70 lbs (31 kg)
Power Input:
200-240 VAC 1 phase, 50/60 Hz, 10 amp max
Circuit Breaker:
16 amp 200-250 VAC 2-pole with 30 mA earth leakage
Remote EMO:
External dry contact
Lam, Applied Materials, TEL, RS232, others
Temperature, fluid level, system or component
failure (display, dry contact and machine interface)
Semi S2-0200, F47 compliant, CE
2 years
*Note: Cooling capacity will vary with configuration and faclity water temperature / flow rates
**Note: Heating capacity is very limited at 80°C. Contact SSCS to discuss alternate solutions.